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HKMA to Tender RMB1.25 Billion in 7-Year Infrastructure Bonds on June 25

HKMA to Tender RMB1.25 Billion in 7-Year Infrastructure Bonds on June 25

The Hong Kong Monetary Authority will tender RMB1.25 billion in 7-year RMB HKSAR bonds on June 25, 2026. The issuance falls under the Infrastructure Bond Programme.

Part of the Infrastructure Bond Programme

The bonds are being sold as part of the Hong Kong government's Infrastructure Bond Programme. That programme allows the government to raise funds for major public works and development projects. The HKMA handles the tenders on behalf of the government.

Tender Details

The bonds have a 7-year maturity. The total amount on offer is RMB1.25 billion. The tender will take place on June 25, 2026. Investors can submit bids through the Hong Kong dollar clearing system.

What to Expect Next

The HKMA will announce the results of the tender after it closes. The bonds are expected to be settled a few days later. Further issuances under the Infrastructure Bond Programme may follow, depending on government funding needs.