SK hynix has started shipping samples of its 12-layer HBM4E memory to major customers, according to the company. The move puts the South Korean chipmaker ahead in the race to supply the next generation of high-bandwidth memory used in artificial intelligence accelerators.
The 12-layer Stack
HBM4E is the latest iteration of high-bandwidth memory, designed to pack more data throughput into a smaller footprint. SK hynix's 12-layer version stacks 12 DRAM dies vertically, reaching capacities and speeds that earlier generations couldn't match. The company says the samples are now in the hands of key clients for evaluation.
Training and running large AI models requires massive memory bandwidth. Chips like Nvidia's H100 and AMD's MI300X rely on HBM to keep data flowing fast. A 12-layer stack doubles the capacity per module compared to the current 8-layer standard, which could let AI systems handle bigger models without adding more hardware. SK hynix's early sample shipments suggest it's aiming to lock in design wins before rivals ramp up their own next-gen memory.
What Comes Next
Customers will test the samples over the coming weeks and months. The company hasn't said when volume production might start, but the evaluation process typically takes a quarter or two before a final order. With AI demand still surging, the winner of this memory race could grab a lucrative slice of the market for years to come.
