Robin Ng, CEO of ASMPT, said that chip architecture will keep evolving as artificial intelligence demands more silicon. That shift, he argued, could significantly boost the semiconductor packaging industry and ripple through global tech markets.
Why chip architecture matters for AI
Ng's comments highlight a central challenge in the AI boom: the need for more powerful and efficient chips. As AI models grow, they require more transistors and faster data movement. That puts pressure on chip designers to rethink how processors are built and how they connect to memory and other components.
“Chip architecture will keep evolving as AI demands more silicon,” Ng said. The statement points to ongoing changes in how chips are laid out and manufactured. Traditional approaches may not keep up with the performance and energy demands of advanced AI workloads.
The packaging opportunity
Semiconductor packaging — the process of enclosing and connecting chips — is often overlooked but critical. Advanced packaging techniques, like stacking chips vertically or using interposers, can improve performance without shrinking transistors further. Ng's remarks suggest that as architecture evolves, packaging will become even more important.
ASMPT is a key player in this space. The company provides equipment and solutions for semiconductor assembly and packaging. Ng's prediction that the industry will see a boost aligns with broader trends: major chipmakers are investing heavily in packaging to keep pace with AI demands.
Global market impact
The implications extend beyond chipmakers. If packaging becomes a bottleneck or a differentiator, it could reshape supply chains and investment priorities. Countries and companies that lead in advanced packaging may gain an edge in the AI race.
Ng's statement comes at a time when the semiconductor industry is already under strain from geopolitical tensions and supply chain disruptions. A shift in architecture and packaging could alter the competitive landscape, affecting everything from smartphone processors to data center servers.
What remains unclear is how quickly these changes will materialize and which companies will benefit most. The evolution Ng describes is not a single event but a continuous process. The next few years will show whether the packaging industry can meet the challenge.
