Trust Stamp has joined the European Union's Important Projects of Common European Interest (IPCEI) semiconductor initiative, a €3 billion effort to develop chip-level biometric identity binding. The digital identity company, known for its work in decentralized identity and biometric verification, will contribute to embedding identity directly into hardware rather than relying solely on software-based solutions.
What is the IPCEI?
The IPCEI is a European Commission program that allows member states to fund large-scale cross-border projects that would otherwise be too risky or capital-intensive for a single country. This particular IPCEI focuses on next-generation semiconductors, with an emphasis on security and energy efficiency. The €3 billion pool includes contributions from several EU governments and private companies.
Trust Stamp's role
Trust Stamp will apply its biometric identity binding technology at the chip level. That means integrating identity verification directly into the silicon, rather than layering it on top of existing hardware. The company says this approach can reduce fraud and improve privacy by keeping biometric data on the device itself.
The initiative ties together two trends: the EU's push for semiconductor sovereignty and the growing need for verifiable digital identity in crypto and beyond. Chip-level identity could eventually underpin everything from self-sovereign identity wallets to hardware-based authentication for blockchain transactions. Trust Stamp's involvement signals that the EU sees biometric binding as a core building block, not an afterthought.
The announcement was published on Crypto Briefing. No timeline or specific deliverables have been disclosed yet.
